Semiconductor Package Temperature Control

Basic requirements for semiconductor packaging temperature

Semiconductor devices need to follow certain temperature requirements during their manufacturing and use. Among them, semiconductor packaging temperature is a very critical factor. Generally speaking, semiconductor packaging temperature requirements should include the following aspects:

1. The packaging temperature cannot be too high. Different types of semiconductor devices have different packaging temperature requirements. On the one hand, if the packaging temperature is too high, it will affect the electrical performance and reliability of the semiconductor device; on the other hand, if the packaging temperature is too low, mechanical stress may occur, affecting the functional performance of the semiconductor device. Therefore, the appropriate packaging temperature must be selected according to specific requirements when formulating the packaging solution.

2. The packaging temperature must comply with the manufacturing process. During the semiconductor manufacturing process, the selection of packaging temperature needs to take into account the integrity and reliability of the process. Generally speaking, manufacturers select packaging temperatures based on product requirements and manufacturing processes to ensure product quality and reliability.

3. Attention should be paid to ventilation and heat dissipation when packaging temperature. The semiconductor packaging temperature will generate a certain amount of heat. If the heat cannot be effectively dissipated, it will affect the working status and life of the semiconductor device. Therefore, during the packaging process, special attention should be paid to ventilation and heat dissipation issues, and appropriate materials and design solutions should be selected to ensure the stability and reliability of semiconductor devices.

Factors affecting semiconductor packaging temperature selection

The selection of semiconductor packaging temperature is affected by many factors, including the following aspects:

1. Device type. Different types of semiconductor devices have different packaging temperature options. For example, the packaging temperature of silicon transistors is generally 200~300℃, while the packaging temperature of IGBT devices is generally 200~250℃.

2. Manufacturing process. The manufacturing process of semiconductor devices also affects the choice of packaging temperature. For example, during the wafer preparation stage, if the temperature is too high, the depth of the doped region may increase, affecting the electrical performance of the device; during the device structure preparation process, reasonable packaging temperature selection can alleviate mechanical stress and improve the reliability of the device. sex.

3. Packaging materials. The thermal expansion coefficient of semiconductor packaging materials also affects the choice of packaging temperature. If the thermal expansion coefficient of the packaging material is too different from that of the device material, temperature changes may cause mechanical displacement, negatively affecting device performance.

4. Ambient temperature. The selection of packaging temperature also needs to consider the temperature changes of the surrounding environment. If the surrounding environment temperature changes greatly, it may cause “thermal fatigue” in semiconductor devices and affect the life of the device.

In short, the temperature requirements for semiconductor packaging are very strict and require trade-offs and considerations among multiple factors. The selection of packaging temperature is not only related to the quality and reliability of the product, but also an important link that needs to be optimized when formulating semiconductor chip manufacturing and packaging solutions.

We provide complete temperature control systems design and manufacturing. From standard models to complete customized products. We specialize in customer service and are dedicated to helping each customer have the optimal temperature control system for their specific need.

We provide non-standard customized solutions. Both single cooling chillers and cooling & heating combo units are available.

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TES Series (Custom Designs)

Suitable for precise temperature control of electronic components. In the manufacture of semiconductor electronic components for harsh environments, the IC packaging assembly and engineering and production testing phases include electronic thermal testing and other environmental testing simulations.

LTS Series (Fluorinated Liquid) (Custom Designs)

Widely used in the semiconductor manufacturing process to control the temperature of the reaction chamber, the temperature of the heat sink, and the temperature control of the non-flammable fluid of the heat transfer medium.

FLT Series (Custom Designs)

The semiconductor temperature control system chiller is mainly used for precise temperature control in the semiconductor production process and testing process. It is specially developed and designed for the semiconductor industry.

FLT Multi Channel Temp Contol (Custom Designs)

Multi channel independent temperature control, which can have a separate temperature range, cooling and heating capacity, thermal conductivity medium flow rate, etc., adopts two independent systems. According to the required temperature range, steam compression refrigeration or ETCU non compressor heat exchange system can be selected. The system can be used for universal expansion tanks, condensers, cooling water systems, etc., which can effectively reduce equipment size and operation steps.

FLTZ Series Frequency Conversion (Custom Designs)

Double frequency conversion series temperature control system, circulation pump and compressor are all adjusted by frequency conversion.

ETCU Series (Custom Designs)

Heat exchange type

System without compressor

ZLFQ Series (Custom Designs)

Coolant Distribution Unit

Liquid cooling equipment is suitable for semiconductor testing, electronic equipment constant temperature testing, cooling server supporting infrastructure, and other fluid temperature control places.

MD Thermal Chucks Series (Custom Designs)

It is used for testing RF devices and high-density power devices (IGBTs and MOSFETs), and can also be used for rapid cooling of laboratory flat panels (plasma, biological products, batteries), etc.

Gas Temperature Control Systems                                                               

AES Series Jet Impact Testing Machine

(Custom Designs)

Temp Control Range: -120°C ~ +225°C

AI Series Recirculating Air Temperature Control System

(Custom Designs)

Temp Control Range: -105°C ~ +125°C

LQ Series Gas Refrigeration System

(Custom Designs)

Temp Control Range: -110°C ~ -40°C

YQH Series VOCs Waste Gas Condensation Recovery Device

(Custom Designs)

Applied to gas condensation liquefaction recovery. The exhaust gas or other electronic gases are connected to the equipment through the induced draft fan (vacuum pump), liquefied, collected and separated into the collection tank by lowering the temperature, and other gases are discharged, so as to realize the condensation, capture and recovery of the gas.

ZLJ / SLJ Series (Custom Designs)

It is suitable for places where the heat exchange area of the heat exchanger is small but the heat exchange capacity is large. It can also be used for gas capture, the refrigerant is directly passed into the trap to evaporate, and the gas in the space is quickly captured through the condensation effect on the surface of the trap.