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Advantages of Semiconductor Chip Liquid Cooling Technology

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Advantages of Semiconductor Chip Liquid Cooling Technology

 

Liquid cooling is to use liquid instead of air to take away the heat generated by IT heating devices such as CPU and memory, just like cooling the server locally. According to the progress of current technical research, liquid cooling is classified into water cooling and refrigerant cooling. Available refrigerants include water, mineral oil, electronic fluorinated fluid, etc.

Liquid cooling has the advantages of low energy consumption, high heat dissipation, and low noise. The cooling capacity of liquid is 1000-3000 times that of air. Liquid cooling technology can achieve the advantages of high density, low noise, low heat transfer temperature difference, and universal natural cooling. Compared with air cooling technology, it has incomparable technical advantages. An excellent cooling solution for scenarios such as deployment density.

(1) Low energy consumption

Short heat transfer path: Cryogenic liquid is directly supplied to communication equipment by CDU (cooling distribution unit);

High heat exchange efficiency: liquid-to-liquid heat exchange is realized through a heat exchanger between the primary side and the secondary side of the liquid cooling system. Combined with three forms of air-liquid heat exchange, liquid-liquid heat exchange, and evaporation-vaporization heat exchange, it has a better heat exchange effect.

High refrigeration energy efficiency: liquid cooling technology can realize high temperature liquid supply at 40~55℃, no compressor chiller is needed, outdoor cooling tower is adopted, which can realize natural cooling throughout the year; in addition to reducing the energy consumption of the refrigeration system itself, liquid cooling heat dissipation technology is adopted It is conducive to further reducing the chip temperature. The lower chip temperature brings higher reliability and lower energy consumption. The energy consumption of the whole machine is expected to be reduced by about 5%.

(2) High heat dissipation

Commonly used media for liquid cooling systems include deionized water, alcohol-based solutions, fluorocarbon working fluids, mineral oil or silicone oil, etc.; the heat carrying capacity, thermal conductivity and enhanced convective heat transfer coefficient of these liquids are much greater than that of air. Therefore, for a single chip, liquid cooling has a higher heat dissipation capability than air cooling. At the same time, liquid cooling directly takes away most of the heat of the equipment through the circulating medium; the overall air supply requirements of the single board, the entire cabinet, and the computer room are greatly reduced, allowing the deployment of high power density equipment; at the same time, more ICT equipment can be arranged in a unit space , Improve data center space utilization and save land area.

(3) Low noise

The liquid cooling heat dissipation technology utilizes the pump to drive the cooling medium to circulate and dissipate heat in the system to solve the heat dissipation problem of all heating devices or key high-power devices; it can cool the fan speed or adopt a fanless design, so it has excellent noise reduction effect and improves The operation and maintenance environment of the computer room is comfortable, and the problem of noise pollution is solved.

 

Custom Chillers                                                                                                                  

 

low temperature chiller

Low Temperature Chillers (Custom Designs)

We specialize in the production of low-temperature chillers with a temperature control range as low as -150°C, which can meet the refrigeration needs of different industries.

Temperature range -25°C ~ -5°C series -45°C ~ -10°C series -60°C ~ -10°C series -80°C ~ -30°C series-110°C ~ -50°C series -150°C ~ -110°C series
Cooling Capacity12 ~ 360kW6 ~ 180kW6 ~ 180kW4 ~ 180kW2 ~ 120kW2.5 ~ 11kW

 


recirculating chiller

Recirculating Chillers (Custom Designs)

Our recirculating chiller adopts low-temperature refrigeration technology, the temperature is as low as -120℃, and various accessories are customizable.

Temperature range -25°C ~ +30°C series -45°C ~ +30°C series -60°C ~ -20°C series -80°C ~ -20°C series -120°C ~ -70°C series
Cooling Capacity0.8 ~ 30kW0.75 ~ 12kW0.4 ~ 6kW0.2 ~ 6kW0.3 ~ 5kW

 


water chiller

Room Temperature Chillers / Small Chillers (Custom Designs)

The chiller can be widely used in various industries and laboratories, and supports customized design.

Temperature range -18°C ~ +30°C +5°C ~ +35°C series
Cooling Capacity0.35 ~ 0.9kW1.8 ~ 50kW

 


Chillers for Automotive Battery Test (Custom Designs)

Temperature simulation for vehicle quality test: battery life test, fuel injector/motor test bench, airbag test, component test bench, etc.

 

Temperature range -25°C ~ +100°C -40°C ~ +100°C0°C ~ +100°C  -40°C ~ +135°C
Cooling Capacity2.8 ~ 38kW1.2 ~ 60kW1.8 ~ 60kW4 ~ 60kW

 

Temperature / Pressure / Flow can be independently controlled.

1&2: one machine for two groups control.

Temperature range -40 ~ +100℃ 1&20 ~ +100℃ 1&2
Cooling Capacity1.8kW*2 ~ 60kW*21.8kW*2 ~ 60kW*2

 

Temperature remains constant, pressure / flow can be independently controlled.

1&3: one machine for three groups control.

1&6: one machine for six groups control.

Temperature range -40 ~ +100℃ 1&2 -40 ~ +100℃ 1&3 -40 ~ +100℃ 1&6 -20 ~ +100℃ 1&6 0 ~ +100℃ 1&2 0 ~ +100℃ 1&3 0 ~ +100℃ 1&6
Cooling Capacity2.5 ~ 60kW4 ~ 60kW10 ~ 60kW10 ~ 60kW7 ~ 60kW11 ~ 60kW18 ~ 60kW

 


Semiconductor Chillers (TES series) (Custom Designs)

Suitable for precise temperature control of electronic components. In the manufacture of semiconductor electronic components for harsh environments, the IC packaging assembly and engineering and production testing phases include electronic thermal testing and other environmental testing simulations.

Temperature range -45°C ~ +250°C series -85°C ~ +200°C series -60°C ~ +200°C series
Cooling Capacity0.3 ~ 25kW0.25 ~ 25kW3 ~ 60kW

 


Semiconductor Chillers (LTS series) (Custom Designs)

Suitable for precise temperature control of electronic components. In the manufacture of semiconductor electronic components for harsh environments, the IC packaging assembly and engineering and production testing phases include electronic thermal testing and other environmental testing simulations.

Temperature range -20°C ~ +80°C series -45°C ~ +80°C series -60°C ~ +80°C series -80°C ~ +80°C series
Flow Control7 ~ 45 L/min7 ~ 45 L/min7 ~ 45 L/min7 ~ 45 L/min

 


 

Chillers for Energy Storage(Custom Designs)

Liquid Cooling Solutions For Battery Energy Storage Systems

 

 

 

Temperature range -45°C ~ +55°C
Cooling Capacity45kW

 


screw-chillers

 

Screw Chillers (Custom Designs)

Low temperature screw chillers and room temperature screw chillers

 

 

Temperature range +5°C ~ +30°C +5°C ~ +30°C +5°C ~ +30°C +5°C ~ +30°C -25°C ~ +5°C -25°C ~ +5°C
Cooling Capacity107 ~ 1027kW (Single Compressor)299 ~ 2134kW (Dual Compressor)98 ~ 934kW (Single Compressor)272 ~ 1940kW (Dual Compressor)48 ~ 467kW (Single Compressor)51 ~ 497kW (Single Compressor)

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