Advantages of Semiconductor Chip Liquid Cooling Technology

Advantages of Semiconductor Chip Liquid Cooling Technology

Liquid cooling is to use liquid instead of air to take away the heat generated by IT heating devices such as CPU and memory, just like cooling the server locally. According to the progress of current technical research, liquid cooling is classified into water cooling and refrigerant cooling. Available refrigerants include water, mineral oil, electronic fluorinated fluid, etc.

Liquid cooling has the advantages of low energy consumption, high heat dissipation, and low noise. The cooling capacity of liquid is 1000-3000 times that of air. Liquid cooling technology can achieve the advantages of high density, low noise, low heat transfer temperature difference, and universal natural cooling. Compared with air cooling technology, it has incomparable technical advantages. An excellent cooling solution for scenarios such as deployment density.

(1) Low energy consumption

Short heat transfer path: Cryogenic liquid is directly supplied to communication equipment by CDU (cooling distribution unit);

High heat exchange efficiency: liquid-to-liquid heat exchange is realized through a heat exchanger between the primary side and the secondary side of the liquid cooling system. Combined with three forms of air-liquid heat exchange, liquid-liquid heat exchange, and evaporation-vaporization heat exchange, it has a better heat exchange effect.

High refrigeration energy efficiency: liquid cooling technology can realize high temperature liquid supply at 40~55℃, no compressor chiller is needed, outdoor cooling tower is adopted, which can realize natural cooling throughout the year; in addition to reducing the energy consumption of the refrigeration system itself, liquid cooling heat dissipation technology is adopted It is conducive to further reducing the chip temperature. The lower chip temperature brings higher reliability and lower energy consumption. The energy consumption of the whole machine is expected to be reduced by about 5%.

(2) High heat dissipation

Commonly used media for liquid cooling systems include deionized water, alcohol-based solutions, fluorocarbon working fluids, mineral oil or silicone oil, etc.; the heat carrying capacity, thermal conductivity and enhanced convective heat transfer coefficient of these liquids are much greater than that of air. Therefore, for a single chip, liquid cooling has a higher heat dissipation capability than air cooling. At the same time, liquid cooling directly takes away most of the heat of the equipment through the circulating medium; the overall air supply requirements of the single board, the entire cabinet, and the computer room are greatly reduced, allowing the deployment of high power density equipment; at the same time, more ICT equipment can be arranged in a unit space , Improve data center space utilization and save land area.

(3) Low noise

The liquid cooling heat dissipation technology utilizes the pump to drive the cooling medium to circulate and dissipate heat in the system to solve the heat dissipation problem of all heating devices or key high-power devices; it can cool the fan speed or adopt a fanless design, so it has excellent noise reduction effect and improves The operation and maintenance environment of the computer room is comfortable, and the problem of noise pollution is solved.

カスタム冷凍機                                                                                                                  

低温チラー (カスタムデザイン)

当社は、-150℃の温度制御範囲を持つ低温冷凍機の生産を専門としており、さまざまな業界の冷凍ニーズを満たすことができます。

循環式チラー (カスタムデザイン)

私達の再循環のスリラーは低温冷凍の技術を採用し、温度は- 120℃と低く、さまざまな付属品はカスタマイズ可能です。

室温チラー/小型チラー (カスタムデザイン)

チラーは様々な産業や研究所で広く使用することができ、カスタマイズされた設計をサポートしています。

Chillers for Automotive Battery Test (カスタムデザイン)

車両品質テスト用温度シミュレーション：バッテリー寿命テスト、燃料噴射装置/モーターテストベンチ、エアバッグテスト、コンポーネントテストベンチなど。

温度／圧力／流量を個別に制御可能。

1&2: 2つのグループコントロールのための1つの機械。

温度は一定で、圧力と流量は独立して制御できる。

1&3：3つのグループコントロールのために1つのマシン。

1&6：1台で6グループをコントロール。

半導体 チラー (TES series) (カスタムデザイン)

電子部品の精密な温度制御に適しています。過酷な環境に対応する半導体電子部品の製造では、ICパッケージの組み立てやエンジニアリング、製造テストの段階で、電子温度テストやその他の環境テストシミュレーションが行われます。

半導体 チラー (LTS series) (カスタムデザイン)

電子部品の精密な温度制御に適しています。過酷な環境に対応する半導体電子部品の製造では、ICパッケージの組み立てやエンジニアリング、製造テストの段階で、電子温度テストやその他の環境テストシミュレーションが行われます。

エネルギー貯蔵用チラー(カスタムデザイン)

Liquid Cooling Solutions For Battery Energy Storage Systems

スクリュー冷凍機 (カスタムデザイン)

低温スクリュー冷凍機と常温スクリュー冷凍機