TES-Components 고온 및 저온 테스트 시스템 소개

Temperature control range：-85°C ~ 200°C ；Power range：2.5kW~25kW；Temperature control accuracy：±0.3°C

Chip-Specific High and Low Temperature Test Boxes In the manufacture of semiconductor electronic components for harsh environments, the IC packaging assembly and engineering and production testing phases include electronic thermal testing at temperatures (-85°C to +200°C) and other environments. Test the simulation. Once put into practical use, these semiconductor devices and electronic products can be exposed to extreme environmental conditions to meet demanding military and telecommunications reliability standards.