Sistema de teste de arrefecimento e aquecimento de chips de potência de semicondutores

2022/10/20 ClassificaçãoNotícias do sector 257

Sistema de teste de arrefecimento e aquecimento de chips de potência de semicondutores

When the high and low temperature test of the semiconductor power chip fails, it is generally impossible to directly see where the fault occurs, and it is impossible to disassemble and dissect the components of the refrigeration system. At this time, the high and low temperature test pressure and temperature detection of the semiconductor power chip are Very important.

First, suction pressure and exhaust pressure:

1. The refrigeration system can be divided into high and low pressure parts during operation. Discharge pressure refers to the pressure of the refrigerant gas in the discharge pipe at the compressor outlet. The suction port pressure of the compressor is called the suction pressure, and the suction pressure is close to the evaporating pressure. The difference between the two is the flow resistance of the pipeline.

2. For convenience, the evaporating pressure and condensing pressure of the refrigeration system are detected at the suction and exhaust ports of the compressor. That is usually called the suction and discharge pressure of the compressor. The purpose of detecting the suction and exhaust pressure of the refrigeration system is to obtain the evaporation temperature and condensation temperature of the refrigeration system, so as to obtain the operation status of the refrigeration system.

Second, condensing pressure:

1. The condensation pressure is the pressure at which the refrigerant condenses into liquid in the condenser. Since the pressure inside the condenser cannot be measured in the high and low temperature test of the semiconductor power chip, in fact, the pressure of the refrigerant in the exhaust pipe and the condenser The drop is actually very small, so it is generally believed that the exhaust pressure is approximately equal to the condensing pressure regardless of design debugging or maintenance.

2. The condensing temperature and the condensing pressure change in direct proportion, and the condensing pressure and the condensing temperature are corresponding; the lower the condensing pressure (high pressure), the lower the condensing temperature; the higher the condensing pressure (high pressure), the higher the condensing temperature. the higher. Knowing the condensing pressure, we can derive a numerical value for the condensing temperature.

3. Under working conditions (refrigerant flow), the greater the heat load, the higher the condensing pressure, and vice versa. When the condenser is small (the heat load is relatively large), the refrigeration system is prone to high pressure alarm.

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